NSF award 2510283 · Dartmouth College

Sustainable Wafer-Scale Manufacturing of Ultra-Thin Semiconductor Materials Enabled by Molten Interfaces

Final report due

28 November 2029

in 1,137 days · The award ends on 31 July 2029.

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award ending 2029-07-31 · Research.gov
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Extension request16 Jun 2029in 972 days
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PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Jul 2029in 1007 days
award ending 2029-07-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Nov 2029in 1137 days
award ending 2029-07-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Nov 2029in 1137 days
award ending 2029-07-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Nov 2029in 1137 days
award ending 2029-07-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 July 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 November 2029.

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Award card

Award number: 2510283
Period of support: 1 Aug 2026 – 31 Jul 2029
Amount: $429,534
Awardee: Dartmouth College, Hanover, NH
Program: AM-Advanced Manufacturing
Directorate: ENG

Abstract

This project advances a new approach to manufacturing ultra-thin semiconductor materials that are essential for next-generation electronics. Technologies such as sensing, communication, and energy systems increasingly rely on materials with precisely controlled thickness at the nanometer scale, yet existing manufacturing methods often require high temperatures, expensive infrastructure, and complex processing steps…

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