NSF award 2518562 · University of Pittsburgh

ENG-SEMICON: Quantum inspired ab initio simulation of thermal transport near heterojunctions

Final report due

30 March 2029

in 894 days · The award ends on 30 November 2028.

GrantClerk is a private service. We are not NSF or any government agency.

Dates this award owes

NSF emails you about this too.

Decide about an extension2 Aug 2028in 654 days
award ending 2028-11-30 · Research.gov
This one is ours, not NSF’s.
Extension request16 Oct 2028in 729 days
award ending 2028-11-30 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice20 Nov 2028in 764 days
award ending 2028-11-30 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due30 Mar 2029in 894 days
award ending 2028-11-30 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due30 Mar 2029in 894 days
award ending 2028-11-30 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out30 Mar 2029in 894 days
award ending 2028-11-30 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

Annual report dates come from the budget period on your award notice. That date is not public, so it is not shown here.

How we got this date

NSF lists this award's end date as 30 November 2028.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 30 March 2029.

Read the rule on Research.gov

Get a note before each report date

Add this award to your desk. We email you before each date and keep the dates in one place.

Renews each year until you cancel. Cancel any time from your account.

Already a member? Sign in

Award card

Award number: 2518562
Period of support: 1 Dec 2025 – 30 Nov 2028
Amount: $449,998
Awardee: University of Pittsburgh, Pittsburgh, PA
Program: TTP-Thermal Transport Process
Directorate: ENG

Abstract

A major challenge in designing modern semiconductor devices is removing heat they generate during routine operations. Heat accumulation reduces device performance, shortens its lifespan, and increases the energy required for cooling. This project will examine heat accumulation near “heterojunctions,” which are tiny nanometer-scale regions where different materials connect to each other. There is an extra thermal…

Is this right?

We copy this from the public NSF award record. Your award notice and NSF always win. If a date looks wrong, check Research.gov.