NSF award 2520269 · University of Washington

Collaborative Research: ASCENT: Optimal Thermal Management for Continued Scaling of 3D Heterogeneous Systems

Final report due

28 January 2030

in 1,198 days · The award ends on 30 September 2029.

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award ending 2029-09-30 · Research.gov
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PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice20 Sep 2029in 1068 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Jan 2030in 1198 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Jan 2030in 1198 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Jan 2030in 1198 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 30 September 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 January 2030.

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Award card

Award number: 2520269
Period of support: 1 Oct 2025 – 30 Sep 2029
Amount: $430,000
Awardee: University of Washington, Seattle, WA
Program: NSF-Intel Semiconductr Partnrs, ASCENT-Address-Chalg-Eng-Teams
Directorate: ENG

Abstract

Recent advancements in Artificial Intelligence (AI) drive unprecedented innovation but face the critical challenge of escalating power consumption. The rapid expansion of AI leads to unsustainable energy use for computation and cooling, threatening its widespread adoption. While three-dimensional heterogeneous integration offers performance and energy efficiency gains through miniaturization for data-intensive AI…

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