NSF award 2522585 · University of Wisconsin-Madison
Collaborative Research: DMREF: AI-Informed, Closed-Loop Design of Negative Resists for High-Volume EUV Lithography
Final report due
28 January 2030
in 1,197 days · The award ends on 30 September 2029.
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- Decide about an extension2 Jun 2029in 957 days
award ending 2029-09-30 · Research.gov
- Extension request16 Aug 2029in 1032 days
award ending 2029-09-30 · Research.gov
- No-cost extension notice20 Sep 2029in 1067 days
award ending 2029-09-30 · Research.gov
- Final report due28 Jan 2030in 1197 days
award ending 2029-09-30 · Research.gov
- Project outcomes report due28 Jan 2030in 1197 days
award ending 2029-09-30 · Research.gov
- Award is closed out28 Jan 2030in 1197 days
award ending 2029-09-30 · Research.gov
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- NSF lists this award's end date as 30 September 2029.
- NSF rules say the final report is due no later than 120 days after that.
- So the final report is due by 28 January 2030.
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Award card
- Award number
- 2522585
- Period of support
- 1 Oct 2025 – 30 Sep 2029
- Amount
- $412,542
- Awardee
- University of Wisconsin-Madison, Madison, WI
- Program
- POLYMERS, DMREF
- Directorate
- MPS
Abstract
Non-technical Description: The mass production of integrated circuits (commonly known as ‘microchips’ or simply ‘chips’) is a key driver for modern computational advances. Chip manufacturing requires a process called photolithography to template the intricate patterns of electronic components. This process uses patterns of light to selectively pattern a material known as a photoresist. New extreme ultraviolet (EUV)…
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