NSF award 2536112 · University of California-San Diego

Boiling Inhibition and High-Flux Evaporation with Engineered Thin Hydrogel Coating

Final report due

28 October 2029

in 1,106 days · The award ends on 30 June 2029.

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award ending 2029-06-30 · Research.gov
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award ending 2029-06-30 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice20 Jun 2029in 976 days
award ending 2029-06-30 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Oct 2029in 1106 days
award ending 2029-06-30 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Oct 2029in 1106 days
award ending 2029-06-30 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Oct 2029in 1106 days
award ending 2029-06-30 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 30 June 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 October 2029.

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Award card

Award number: 2536112
Period of support: 1 Jul 2026 – 30 Jun 2029
Amount: $650,000
Awardee: University of California-San Diego, LA Jolla, CA
Program: TTP-Thermal Transport Process
Directorate: ENG

Abstract

As computing devices become smaller and more powerful, they generate more heat that must be removed to keep them working reliably. Heat removal is especially important for artificial intelligence chips and data centers. Data center energy use is expected to more than double by 2030, consuming up to 4% of the world’s electricity. A large part of that energy is spent on cooling. Improvements are required in current…

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