NSF award 2542270 · University of Connecticut

CAREER: 3D One-step Heterogeneous Manufacturing for Integrated Circuits (3D OHMIC)

Final report due

29 December 2031

in 1,898 days · The award ends on 31 August 2031.

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Dates this award owes

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Decide about an extension3 May 2031in 1658 days
award ending 2031-08-31 · Research.gov
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Extension request17 Jul 2031in 1733 days
award ending 2031-08-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Aug 2031in 1768 days
award ending 2031-08-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due29 Dec 2031in 1898 days
award ending 2031-08-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due29 Dec 2031in 1898 days
award ending 2031-08-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out29 Dec 2031in 1898 days
award ending 2031-08-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 August 2031.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 29 December 2031.

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Award card

Award number: 2542270
Period of support: 1 Sep 2026 – 31 Aug 2031
Amount: $549,994
Awardee: University of Connecticut, Storrs, CT
Program: AM-Advanced Manufacturing
Directorate: ENG

Abstract

Additive manufacturing techniques that use light, such as stereolithography and digital light processing, have transformed the fabrication of complex three-dimensional (3D) structures, enabling advances in biomedical devices, soft robotics, and advanced sensing technologies. Despite this progress, current approaches remain limited by slow printing speeds, restricted material choices, limited resolution, and reliance…

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