NSF award 2545888 · University of California-Riverside

CAREER: Uncover contact line dynamics during thin film evaporation on micro/nano-engineered surfaces with combined velocimetry, thermometry, and interferometry

Final report due

28 October 2028

in 741 days · The award ends on 30 June 2028.

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Dates this award owes

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Decide about an extension2 Mar 2028in 501 days
award ending 2028-06-30 · Research.gov
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Extension request16 May 2028in 576 days
award ending 2028-06-30 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice20 Jun 2028in 611 days
award ending 2028-06-30 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Oct 2028in 741 days
award ending 2028-06-30 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Oct 2028in 741 days
award ending 2028-06-30 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Oct 2028in 741 days
award ending 2028-06-30 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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How we got this date

NSF lists this award's end date as 30 June 2028.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 October 2028.

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Award card

Award number: 2545888
Period of support: 1 Sep 2025 – 30 Jun 2028
Amount: $595,739
Awardee: University of California-Riverside, Riverside, CA
Program: EPSCoR Co-Funding, TTP-Thermal Transport Process
Directorate: ENG

Abstract

Computers and electronics with ever-increasing power densities have become an indispensable part of our daily life to support our learning, communication, driving, and other applications. Effective thermal management technologies are essential to cool these devices to a safe temperature to sustain their high performance. Thin film evaporation, based on continuous evaporation of very thin films of liquid coolant, is…

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