NSF award 2546677 · Boise State University

E-RISE: Capacity Building for Resilient Microelectronics for Extreme Environments (XTREME) Program

Final report due

28 November 2030

in 1,502 days · The award ends on 31 July 2030.

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Decide about an extension2 Apr 2030in 1262 days
award ending 2030-07-31 · Research.gov
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Extension request16 Jun 2030in 1337 days
award ending 2030-07-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Jul 2030in 1372 days
award ending 2030-07-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Nov 2030in 1502 days
award ending 2030-07-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Nov 2030in 1502 days
award ending 2030-07-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Nov 2030in 1502 days
award ending 2030-07-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 July 2030.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 November 2030.

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Award card

Award number: 2546677
Period of support: 1 Aug 2026 – 31 Jul 2030
Amount: $7,997,725
Awardee: Boise State University, Boise, ID
Program: EPSCoR RII: E-RISE
Directorate: O/D

Abstract

The Idaho EPSCoR jurisdiction's E‑RISE project, "Capacity Building for Resilient Microelectronics for Extreme Environments (XTREME)" investigates materials behavior under high temperature, radiation, and mechanical stress – conditions central to national needs in energy, defense, and aerospace. Catalyzed by Micron Technology's $25 billion investment in Boise, and a $25 million gift to Boise State University…

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