NSF award 2550199 · Trustees of Boston University

POSE: Phase 1: Parallel Compact Thermal Simulator-Open-Source Ecosystem (PACT-OSE): Building an Ecosystem for Thermal Modeling of Chiplet-based Integration

Final report due

28 October 2027

in 375 days · The award ends on 30 June 2027.

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Decide about an extension2 Mar 2027in 135 days
award ending 2027-06-30 · Research.gov
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Extension request16 May 2027in 210 days
award ending 2027-06-30 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice20 Jun 2027in 245 days
award ending 2027-06-30 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Oct 2027in 375 days
award ending 2027-06-30 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Oct 2027in 375 days
award ending 2027-06-30 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Oct 2027in 375 days
award ending 2027-06-30 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 30 June 2027.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 October 2027.

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Award card

Award number: 2550199
Period of support: 15 Jul 2026 – 30 Jun 2027
Amount: $300,000
Awardee: Trustees of Boston University, Boston, MA
Program: POSE
Directorate: TIP

Abstract

Managing heat in semiconductor systems is a critical prerequisite to improving computing performance, energy efficiency, and reliability. This requirement is especially important in new chip designs that stack and combine multiple components in compact spaces. Such systems lead to concentrated heat and increased risk of failure. Additionally, existing thermal analysis tools are often slow, expensive, or inaccessible…

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