NSF award 2604563 · New York University

Supporting Cross-Scale Spatial Reasoning in Chip Design Education using Immersive Virtual Reality Learning Environments

Final report due

29 December 2029

in 1,168 days · The award ends on 31 August 2029.

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award ending 2029-08-31 · Research.gov
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Extension request17 Jul 2029in 1003 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Aug 2029in 1038 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 August 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 29 December 2029.

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Award card

Award number: 2604563
Period of support: 1 Sep 2026 – 31 Aug 2029
Amount: $900,000
Awardee: New York University, NEW York, NY
Program: Cyberlearn & Future Learn Tech
Directorate: EDU

Abstract

Because of the projected workforce shortfall in the education of chip design and fabrication, this project proposes new approaches to chip design education that expand accessibility, scale, and engagement while cultivating a critical cognitive capability of spatial reasoning. This need is addressed through an immersive Virtual Reality Learning Environment (VRLE) that leverages the affordances of VR to develop…

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