NSF award 2611297 · Michigan State University

Multi-Layer Optical Interconnects and Thermal Management for High-Density Chiplet-Based 3D Heterogeneous Integration

Final report due

28 January 2030

in 1,198 days · The award ends on 30 September 2029.

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award ending 2029-09-30 · Research.gov
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award ending 2029-09-30 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice20 Sep 2029in 1068 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Jan 2030in 1198 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Jan 2030in 1198 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Jan 2030in 1198 days
award ending 2029-09-30 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 30 September 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 January 2030.

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Award card

Award number: 2611297
Period of support: 1 Oct 2026 – 30 Sep 2029
Amount: $379,822
Awardee: Michigan State University, East Lansing, MI
Program: CSCS: Circuits and Systems for
Directorate: ENG

Abstract

Artificial intelligence, advanced computing, and data-intensive applications require electronic systems that can move substantially larger amounts of data while removing more heat from increasingly compact hardware. Modern computing modules often combine many specialized chips, or “chiplets,” within a single package to improve performance and energy efficiency. However, existing packaging approaches increasingly…

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