NSF award 2622185 · Cornell University

EAGER: Collaborative Research: In situ Thermal-mechanical Localization Metrology for Advanced 3D Packaging

Final report due

29 December 2028

in 803 days · The award ends on 31 August 2028.

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award ending 2028-08-31 · Research.gov
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PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Aug 2028in 673 days
award ending 2028-08-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due29 Dec 2028in 803 days
award ending 2028-08-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due29 Dec 2028in 803 days
award ending 2028-08-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out29 Dec 2028in 803 days
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PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 August 2028.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 29 December 2028.

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Award card

Award number: 2622185
Period of support: 1 Sep 2026 – 31 Aug 2028
Amount: $150,000
Awardee: Cornell University, Ithaca, NY
Program: AM-Advanced Manufacturing
Directorate: ENG

Abstract

Advanced three-dimensional (3D) packaging plays a critical role in the performance of miniaturized semiconductor devices. Owing to reduced component dimension, high-density stacking, and complex interconnection inherent to 3D packaging, significant temperature rise and complex thermal-mechanical stress are generated inside multiple hierarchical levels, degrading transistor performance and accelerating device…

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