NSF award 2622748 · Florida International University

Rapid In-Line Identification of Defects in Electronics Manufacturing

Final report due

29 December 2029

in 1,168 days · The award ends on 31 August 2029.

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Decide about an extension3 May 2029in 928 days
award ending 2029-08-31 · Research.gov
This one is ours, not NSF’s.
Extension request17 Jul 2029in 1003 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Aug 2029in 1038 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 August 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 29 December 2029.

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Award card

Award number: 2622748
Period of support: 15 Sep 2026 – 31 Aug 2029
Amount: $675,000
Awardee: Florida International University, Miami, FL
Program: CSCS: Circuits and Systems for
Directorate: ENG

Abstract

This research project addresses a critical challenge in semiconductor manufacturing: the inability of current inspection technologies to detect defects hidden beneath the surface of complex electronic packages. As devices become smaller and more densely packed, undetected subsurface defects can lead to costly yield losses and reliability issues. By pioneering a new approach that combines millimeter-wave imaging,…

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