NSF award 2622752 · University of Illinois at Urbana-Champaign

Chemical Interface Damping at Metal-Semiconductor Junctions

Final report due

29 December 2029

in 1,168 days · The award ends on 31 August 2029.

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Decide about an extension3 May 2029in 928 days
award ending 2029-08-31 · Research.gov
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Extension request17 Jul 2029in 1003 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Aug 2029in 1038 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out29 Dec 2029in 1168 days
award ending 2029-08-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 August 2029.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 29 December 2029.

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Award card

Award number: 2622752
Period of support: 1 Sep 2026 – 31 Aug 2029
Amount: $600,000
Awardee: University of Illinois at Urbana-Champaign, Urbana, IL
Program: ELECTRONIC/PHOTONIC MATERIALS
Directorate: MPS

Abstract

Nontechnical description This project aims to characterize how light absorbed by particles a few billionths of a meter (nanometers) in size is converted to electrical currents, while the generation of heat is minimized. Such efficient conversion is best achieved with hybrid materials consisting of a strong absorber and a layer that promotes the lifetime and mobility of the electrons responsible for the currents.…

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