NSF award 2624348 · Boise State University
EPSCoR Research Fellows: NSF: Wafer-Scale Fabrication and Packaging of Magnetic Planar Inductors on Silicon Carbide for Extreme- Environment Microelectronics
Final report due
30 April 2029
in 925 days · The award ends on 31 December 2028.
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Dates this award owes
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- Decide about an extension2 Sep 2028in 685 days
award ending 2028-12-31 · Research.gov
- Extension request16 Nov 2028in 760 days
award ending 2028-12-31 · Research.gov
- No-cost extension notice21 Dec 2028in 795 days
award ending 2028-12-31 · Research.gov
- Final report due30 Apr 2029in 925 days
award ending 2028-12-31 · Research.gov
- Project outcomes report due30 Apr 2029in 925 days
award ending 2028-12-31 · Research.gov
- Award is closed out30 Apr 2029in 925 days
award ending 2028-12-31 · Research.gov
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How we got this date
- NSF lists this award's end date as 31 December 2028.
- NSF rules say the final report is due no later than 120 days after that.
- So the final report is due by 30 April 2029.
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Award card
- Award number
- 2624348
- Period of support
- 15 Jan 2027 – 31 Dec 2028
- Amount
- $282,012
- Awardee
- Boise State University, Boise, ID
- Program
- EPSCoR RII: EPSCoR Research Fe
- Directorate
- O/D
Abstract
This Research Infrastructure Improvement (RII) EPSCoR Research Fellows project provides a fellowship to an Assistant Professor and training for a graduate student at Boise State University. This work is conducted in collaboration with Dr. Alan Mantooth and Dr. David Huitink at the University of Arkansas. Through the fellowship, the PI will develop compact inductors with magnetic cores that can operate reliably at…
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