NSF award 2627843 · Villanova University

I-Corps: Translation potential of a direct-to-chip (D2C) cold plate for electronic cooling and data centers

Final report due

28 November 2027

in 406 days · The award ends on 31 July 2027.

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award ending 2027-07-31 · Research.gov
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Extension request16 Jun 2027in 241 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Jul 2027in 276 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Nov 2027in 406 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Nov 2027in 406 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Nov 2027in 406 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 July 2027.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 November 2027.

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Award card

Award number: 2627843
Period of support: 1 Aug 2026 – 31 Jul 2027
Amount: $50,000
Awardee: Villanova University, Villanova, PA
Program: I-Corps
Directorate: TIP

Abstract

This I-Corps project is based on the development of a direct-to-chip cold plate for electronic cooling in data centers. Currently, hyperscale data centers and high-performance computing systems use traditional air and liquid cooling methods that are increasingly inadequate for handling the heat generated by advanced Artificial Intelligence (AI) and High-Performance Computing (HPC) chips. The cold plate technology is…

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