NSF award 2627984 · Massachusetts Institute of Technology

I-Corps: Translation Potential of a Co-Packaged Optics Platform for Scalable Electronic-Photonic Integration

Final report due

28 November 2027

in 406 days · The award ends on 31 July 2027.

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Decide about an extension2 Apr 2027in 166 days
award ending 2027-07-31 · Research.gov
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Extension request16 Jun 2027in 241 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “at least 45 days prior to the end date”
No-cost extension notice21 Jul 2027in 276 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “at least ten calendar days prior to the end date”
Final report due28 Nov 2027in 406 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “no later than 120-days following the end date of the award”
Project outcomes report due28 Nov 2027in 406 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “no later than 120 days following the end date”
Award is closed out28 Nov 2027in 406 days
award ending 2027-07-31 · Research.gov
PAPPG 24-1: “financially closed out 120 days after their expiration date”

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NSF lists this award's end date as 31 July 2027.
NSF rules say the final report is due no later than 120 days after that.
So the final report is due by 28 November 2027.

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Award card

Award number: 2627984
Period of support: 1 Aug 2026 – 31 Jul 2027
Amount: $49,999
Awardee: Massachusetts Institute of Technology, Cambridge, MA
Program: I-Corps
Directorate: TIP

Abstract

This I-Corps project is based on the development of advanced semiconductor packaging technology used in the manufacture of electronics. The technology allows electronic and optical components to be combined onto the same integrated circuit (“chip”) using existing manufacturing equipment. The growing use of artificial intelligence (AI) and cloud computing requires ever-faster ways to move information between chips.…

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